Tokyo Seimitsu

7729

Tokyo Seimitsu Co., Ltd., together with its subsidiaries, manufactures and sells semiconductor manufacturing equipment and measuring instruments in Japan, China, Taiwan, South Korea, rest of East Asia, Southeast Asia, and internationally. It operates through Semiconductor Production Equipment (SPE) and Metrology Equipment segments. The company offers wafer dicing and probing machines, polish and high rigid grinders, wafer manufacturing machines, chemical mechanical planarizers, edge shaping products, sliced wafer demounting and cleaning machines, precision dicing blades, and equipment for dicing and probing machines. It also provides 3D coordinate measuring machines, x-ray CT systems, non-contact and surface texture and contour measuring instruments, optical shaft measuring system, roundness and cylindrical profile measuring instruments, dedicated measuring machines, discharge test systems, and power supply evaluation services. In addition, the company offers laser interferometers, non-contact displacement sensors, grinder and lathe, machining center, sensors and electric/air micrometers, machine control gauges, various automated measuring, sorting and assembling machines, software products, and related accessories. The company was formerly known as Tokyo Seimitsu Kogu Co., Ltd. and changed its name to Tokyo Seimitsu Co., Ltd. in April 1962. Tokyo Seimitsu Co., Ltd. was incorporated in 1949 and is headquartered in Hachioji, Japan.

Read Less