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NanJing Sanchao Advanced Materials Earnings
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About NanJing Sanchao Advanced Materials Co.,Ltd.
NanJing Sanchao Advanced Materials Co.,Ltd.
300554
NanJing Sanchao Advanced Materials Co.,Ltd. researches, develops, and manufactures diamond and CBN tools for automobile, semiconductor, photovoltaic solar, and cemented carbide industries. It offers electroplated diamond wires, diamond wires for sapphire and silicon slicing, and silicon bricking/squaring/cropping; precision tools, including dicing blades, edge wheel for sapphire wafers, notched wheel for silicon and sapphire wafers, back grinding for diamond wheels for silicon wafers, hubless blades, and CMP-disk; and semiconductor manufacturing equipment. The company provides grinding wheels; grooving of diamond and CBN wheel; segmented difference wheel; diamond and CBN wheels; double griding disk; peripheral grinding wheels; centerless griding wheels; griding wheels for crankshaft, inner hole machining, and bearing; and verified bond wheels, as well as diamond and CBN griding wheels. In addition, it offers cutting fluids for sapphire wafers, silicon, and polysilicon cutting applications and grinding of optical lens, prism lens, and plane mirror. The company was founded in 1999 and is headquartered in Nanjing, China.
NanJing Sanchao Advanced Materials Co.,Ltd. researches, develops, and manufactures diamond and CBN tools for automobile, semiconductor, photovoltaic solar, and cemented carbide industries. It offers electroplated diamond wires, diamond wires for sapphire and silicon s...
NanJing Sanchao Advanced Materials Co.,Ltd. researches, develops, and manufactures diamond and CBN tools for automobile, semiconductor, photovoltaic solar, and cemented carbide industries. It offers electroplated diamond wires, diamond wires for sapphire and silicon slicing, and silicon bricking/squaring/cropping; precision tools, including dicing blades, edge wheel for sapphire wafers, notched wheel for silicon and sapphire wafers, back grinding for diamond wheels for silicon wafers, hubless blades, and CMP-disk; and semiconductor manufacturing equipment. The company provides grinding wheels; grooving of diamond and CBN wheel; segmented difference wheel; diamond and CBN wheels; double griding disk; peripheral grinding wheels; centerless griding wheels; griding wheels for crankshaft, inner hole machining, and bearing; and verified bond wheels, as well as diamond and CBN griding wheels. In addition, it offers cutting fluids for sapphire wafers, silicon, and polysilicon cutting applications and grinding of optical lens, prism lens, and plane mirror. The company was founded in 1999 and is headquartered in Nanjing, China.
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