Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for display driver chips in China. The company provides bump manufacturing (bumping), wafer testing (CP), chip on glass (COG), and chip on film (COF) processing services. Its products are used primarily in smartphones, HDTVs, laptops, tablets, automotive electronics, smart wearables, electronic tags, and other categories. The company was founded in 2015 and is headquartered in Hefei, China.

Sector

Industry

CEO

Zheng, Ruijun

Employees

1,559

Website

www.unionsemicon.com.cn

IPO Date

Headquarters

No. 8, Xiangwang Road, Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei, Anhui Province, 230012, China

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