Hefei Chipmore Technology Co.,Ltd. operates as a packaging and testing service provider for integrated circuits. The company offers packaging and testing solutions, including bump processing, wafer testing, grinding and cutting, packaging and testing, etc., as well as supporting services, such as mask design, COF tape and reel graphic design, test program development, and probe card design and maintenance. Its packaging and testing products include various display driver chips, power management chips, RF front-end chips, etc. used in high-definition TV, smart phone, automotive electronics, smart wear, electronic communications, industrial control, and other fields. The company was founded in 2004 and is based in Hefei, China.

Sector

Industry

CEO

Yang, Zongming

Employees

2,292

Website

www.chipmore.com.cn

IPO Date

Headquarters

Xinzhan Comprehensive Bonded Zone, Xinzhan District, Hefei, Anhui Province, 230011, China

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Hefei Chipmore Technology 688352

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About Hefei Chipmore Technology Co.,Ltd.

Hefei Chipmore Technology
688352