Micro-Mechanics (Holdings)

5DD

Micro-Mechanics (Holdings) Ltd. designs, manufactures, and markets precision parts and tools for the wafer-fabrication, assembly, and testing processes of the semiconductor industry. The company offers die attach-pick-up products, such as rubber tips, high-temp plastic tools, tungsten carbide die collets, sensor assemblies, and vacuum wand tools; die attach-dispensing products, including dispensing nozzle adaptors, dispense nozzles, pen dispensing assemblies, writing pen nozzle tips, and epoxy stamping tools; and die attach-die ejection products comprising ejector needles, needle holders/pepper pots, and needle holder seals. It also provides wire bonding products consisting of thermosonic bonding products, which include clamps and electronic flame off products; and ultrasonic bonding products, such as clamps, bearing base assemblies, anvils, and wire cutters. In addition, the company offers encapsulation products, including BGA dispensing nozzles, dispensing manifolds, pump screws, and O-rings, as well as engages in the contract manufacturing and sale of precision parts and tools. It operates in Singapore, Malaysia, the Philippines, the United States, the People’s Republic of China, Thailand, Taiwan, Europe, Japan, and internationally. The company was founded in 1983 and is headquartered in Singapore.

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